Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding)

Intel · Kulim, MY

Intel is hiring for Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding) in Kulim, MY. What you'll do: hiring, work across the compliance domain. Qualifications: a bachelor's degree. On-site, paying $10K–$100K.

Occupation classification pending for this posting — SOC-level hiring signals will appear here once the classifier tags it.

Salary: $10k–$100k · onsite
Source: intel.wd1.myworkdayjobs.com
Original link: https://intel.wd1.myworkdayjobs.com/en-US/External/job/Malaysia-Kulim/Process-and-Equipment-Module-Engineer--DIE-Attach-or-Thermal-Compress-Bonding-_JR0279601
ATS: Workday
Posted: 3 days ago (2026-05-06)
Status: active

Topics: Compliance

Activities: Hiring

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